-
SKPM LifeScience Resistance Hydroxyapatite Boundary Wonseok FAFailureAnlaysis Bio Chungnam_National_University Zhi Ferroelectric Tin sulfide MfmPhase BariumTitanate InorganicCompound Reading Edwin Bacteria Lattice IRDetector ForceDistanceSpectroscopy light_emission Pattern Reduction PetruPoni_Institute Layer FAPbI3 cannabis Inorganic Lateral CompactDisk CastIron mechanical_property LFM AdhesionForce
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
TSV Cu pad oxidation
Scanning Conditions
- System : NX-Wafer
- Scan Mode: Non-contact
- Scan Rate : All 1 Hz
- Scan Size : 40μm×40μm
- Pixel Size : All 512×512
- Cantilever : OMCL-AC160TS (k=26N/m, f=300kHz)